韩国媒体《朝鲜日报》6月9日报道，SK海力士已向内部供应商发出通知，计划最早于8月开始扩大HBM4（High Bandwidth Memory 4）内存芯片的量产规模。据熟悉内情的消息人士透露，SK海力士位于韩国平泽（Pyeongtaek）的N2工厂将把HBM4的月产能从目前的每月3万片晶圆提升至6万片以上。
The Korean newspaper Chosun Ilbo reported on June 9 that SK Hynix has notified its internal suppliers of plans to begin expanding HBM4 (High Bandwidth Memory 4) memory chip mass production as early as August. According to sources familiar with the situation, SK Hynix's N2 factory in Pyeongtaek, South Korea, will increase HBM4 monthly capacity from the current 30,000 wafers to over 60,000 per month.
HBM4：AI芯片的"瓶颈级"关键组件
HBM4: The "Bottleneck" Critical Component for AI Chips
HBM（高带宽内存）是AI训练芯片不可或缺的配套组件。与传统的DRAM不同，HBM通过3D堆叠技术将内存芯片垂直堆叠在一起，通过硅通孔（TSV）实现超高带宽连接。在NVIDIA B200、AMD MI400等主流AI训练芯片中，每颗GPU通常需要搭配8至16颗HBM3e或HBM4内存芯片，总带宽可达每秒数TB。
HBM (High Bandwidth Memory) is an indispensable companion component for AI training chips. Unlike traditional DRAM, HBM uses 3D stacking technology to vertically stack memory chips together, achieving ultra-high bandwidth connections through silicon through-vias (TSV). In mainstream AI training chips like NVIDIA B200 and AMD MI400, each GPU typically requires 8 to 16 HBM3e or HBM4 memory chips, with total bandwidth reaching several terabytes per second.
HBM4是HBM3e的下一代标准，带宽将从目前的4.3GB/s提升至8.5GB/s以上，同时功耗降低了约30%。更重要的是，HBM4支持更灵活的内存配置和chiplet架构，使其能够适应从云端训练到边缘推理的全场景需求。这些特性使得HBM4成为AI芯片厂商争夺的焦点。
HBM4 is the next-generation standard following HBM3e, with bandwidth increasing from the current 4.3GB/s to over 8.5GB/s, while power consumption drops by approximately 30%. More importantly, HBM4 supports more flexible memory configurations and chiplet architecture, enabling it to meet full-scenario needs from cloud training to edge inference. These characteristics make HBM4 the focal point of competition among AI chip manufacturers.
SK海力士的"扩产竞赛"：与三星的正面交锋
SK Hynix's "Expansion Race": Direct Confrontation with Samsung
SK海力士的扩产动作并非孤立事件。韩国半导体行业正处于一场激烈的扩产竞赛中。SK海力士的竞争对手三星电子（Samsung Electronics）同样计划在今晚第三季度扩大HBM产能，据供应链消息，三星位于华城（Hwaseong）的工厂已在紧急采购HBM4生产所需的先进设备。日本美光（Micron）也在加速推进其HBM4产能规划，计划将年产能从目前的80万片提升至150万片。
SK Hynix's expansion move is not an isolated event. The Korean semiconductor industry is in the midst of an intense expansion race. SK Hynix's competitor Samsung Electronics also plans to expand HBM capacity in the third quarter of this year. According to supply chain sources, Samsung's Hwaseong factory has been urgently procuring advanced equipment needed for HBM4 production. Japanese Micron is also accelerating its HBM4 capacity planning, with plans to increase annual capacity from the current 800,000 wafers to 1.5 million.
高盛的半导体研究主管Tom O'Malley指出："全球HBM市场正在经历一场供需严重失衡的紧张期。SK海力士的扩产计划表明，它试图利用目前的窗口期进一步拉大与竞争对手的产能差距。但三星绝不会坐视不管。"
Tom O'Malley, lead semiconductor research director at Goldman Sachs, noted: "The global HBM market is experiencing a period of severe supply-demand imbalance. SK Hynix's expansion plan shows it's attempting to use the current window to further widen its capacity gap with competitors. But Samsung will absolutely not sit idly by."
供应链冲击：谁在HBM扩产中获益？
Supply Chain Impact: Who Benefits from HBM Expansion?
HBM扩产带来的产业链效应正在全球范围内显现。HBM4的生产需要先进的封装设备（如台积电的CoWoS技术）、高纯度硅中介层（Substrate）和特殊的冷却方案。台湾台积电（TSMC）作为AI芯片封装的主要供应商，其股价在SK海力士扩产消息传出后上涨了4.2%。日本东京电子（Tokyo Electron）和screen半导体等封装设备供应商也迎来了订单激增。
The supply chain effects of HBM expansion are being felt globally. HBM4 production requires advanced packaging equipment (like TSMC's CoWoS technology), high-purity silicon interposers (Substrate), and specialized cooling solutions. Taiwan's TSMC, as the primary supplier for AI chip packaging, saw its stock price rise 4.2% following SK Hynix's expansion news. Japanese Tokyo Electron and screen Semiconductor also saw a surge in orders for packaging equipment suppliers.
中国半导体企业也在关注HBM4的动向。尽管目前中国企业在HBM领域的技术水平与韩国、美国企业存在代差，但多家国内存储芯片企业已将HBM4列为重点研发方向。长江存储（YMTC）的一位技术主管对媒体表示："HBM4是未来三年全球内存市场最确定的增量。我们必须跟紧。"
Chinese semiconductor companies are also watching HBM4 developments closely. Although Chinese companies currently lag behind Korean and American firms in HBM technology levels, multiple domestic memory chip companies have designated HBM4 as a key R&D direction. A technical executive at Yangtze Memory Technologies Corp (YMTC) stated to media: "HBM4 is the most certain growth area in the global memory market over the next three years. We must keep pace."
未来展望：HBM市场的"十年黄金期"
Future Outlook: The "Golden Decade" for HBM Markets
行业研究机构TrendForce的最新预测显示，全球HBM市场规模将在2026年达到280亿美元，2027年增长至420亿美元，2028年有望突破600亿美元。这一增长的主要驱动力是AI大模型训练对算力和内存带宽的持续需求。一位不愿具名的半导体行业资深分析师表示："从现在到2030年，HBM市场将是一个典型的卖方市场。谁能先扩产，谁就能赚到这一轮AI基建的红利。"
The latest forecast from industry research firm TrendForce shows the global HBM market will reach $28 billion in 2026, grow to $42 billion in 2027, and is expected to surpass $60 billion by 2028. The primary driver of this growth is the continuing demand for compute and memory bandwidth in AI large model training. A senior semiconductor industry analyst, speaking on condition of anonymity, stated: "From now until 2030, the HBM market will be a classic seller's market. Whoever expands first will capture the dividends of this AI infrastructure boom."
SK海力士的扩产计划，只是全球半导体行业在AI浪潮下加速重构的一个缩影。当内存芯片成为AI时代的"新石油"时，这场关于产能、技术和供应链主导权的竞赛，才刚刚开始。
SK Hynix's expansion plan is merely a microcosm of the global semiconductor industry's accelerated restructuring under the AI wave. When memory chips become the "new oil" of the AI era, this race for capacity, technology, and supply chain dominance has only just begun.